Application of Taguchi optimization method for cutting wafer parameters
碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 104 === This paper cutting affect the quality characteristics of the wafer process for encapsulating a semiconductor, with the IC element towards the rapid, versatile, thin direction,Since the semiconductor packaging industry to cut the wafer (Wafer Saw) manufact...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/fsbqzq |