Analysis of Conducted Transient Noise Immunity and BCI Coupling Path for Chip and Board Level Application

碩士 === 逢甲大學 === 通訊工程學系 === 104

Bibliographic Details
Main Author: 呂政儀
Other Authors: 林漢年
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/95174111429025297301
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spelling ndltd-TW-104FCU056500182017-08-20T04:07:35Z http://ndltd.ncl.edu.tw/handle/95174111429025297301 Analysis of Conducted Transient Noise Immunity and BCI Coupling Path for Chip and Board Level Application 晶片及電路板層級之暫態傳導干擾與大電流干擾耦合路徑之分析 呂政儀 碩士 逢甲大學 通訊工程學系 104 林漢年 2016 學位論文 ; thesis 90 zh-TW
collection NDLTD
language zh-TW
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description 碩士 === 逢甲大學 === 通訊工程學系 === 104
author2 林漢年
author_facet 林漢年
呂政儀
author 呂政儀
spellingShingle 呂政儀
Analysis of Conducted Transient Noise Immunity and BCI Coupling Path for Chip and Board Level Application
author_sort 呂政儀
title Analysis of Conducted Transient Noise Immunity and BCI Coupling Path for Chip and Board Level Application
title_short Analysis of Conducted Transient Noise Immunity and BCI Coupling Path for Chip and Board Level Application
title_full Analysis of Conducted Transient Noise Immunity and BCI Coupling Path for Chip and Board Level Application
title_fullStr Analysis of Conducted Transient Noise Immunity and BCI Coupling Path for Chip and Board Level Application
title_full_unstemmed Analysis of Conducted Transient Noise Immunity and BCI Coupling Path for Chip and Board Level Application
title_sort analysis of conducted transient noise immunity and bci coupling path for chip and board level application
publishDate 2016
url http://ndltd.ncl.edu.tw/handle/95174111429025297301
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