Characterization of Plasma Effects on Low-k Film
碩士 === 中原大學 === 化學工程研究所 === 104 === Plasma technology is extensively used in the etching of low-dielectric constant (low-k) materials in semiconductor industry. However, the low-k films are vulnerable to the damaged by plasma species during dry etching and ashing. This study focuses on gaining funda...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/58863520843671348276 |