Fabrication of diamond-like carbon films for heat dissipation application in mobile electronic communication devices
碩士 === 國立臺北科技大學 === 機電整合研究所 === 103 === Diamond-like carbon (DLC) film has become a promising engineering materials due to its intrinsic outstanding physical and chemical characteristics such as hardness, chemical inertness, wear resistant, and biocompatibility. Recently, due to high thermal conduct...
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Online Access: | http://ndltd.ncl.edu.tw/handle/2an7ep |