Using Taguchi Methods to Optimize the Process Parameters and Define the Process Specification in Solder Paste Printing
碩士 === 國立臺北科技大學 === 工業工程與管理系碩士班 === 103 === With the evolving electronics manufacturing industry technology of the surface mount technology (SMT) is main processes for the assembly of printed circuit board (PCBA). Approximately 52% -71% percent of soldering defects are attributable to the solder pas...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/x352te |