Development of Solder Plate Soldering Technology to Replace BGA Soldering
碩士 === 中國文化大學 === 機械工程學系數位機電碩士班 === 103 === As the technology is developing fast, the main trend of electronic products is toward small size, light weight and thin thickness a, the related market is growing as well. In order to meet market needs, the traditional manual welding technology for electro...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66309649538168287302 |