Deawing and Die Design for Cover of Electronic Lock
碩士 === 國立虎尾科技大學 === 機械與電腦輔助工程系碩士班在職專班 === 103 === This study developed electronic lock covers by using SUS304 stainless material and investigated the drawing processes and die design for such covers. The cover of the electronic locks was 2.5 mm in thickness, necessitating a thick-plate-deep-drawing...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4wth5c |