Effects of Convection Strength and ElectricalPotential on the Rapid Quantitative of Organic Additives in Advanced Copper Electro-Plating
碩士 === 國立聯合大學 === 化學工程學系碩士班 === 103 === The rapid quantitative method of organic additives were studied for the copper plating solutions with two different electrical potential at different convection strengths. The copper deposition techniques was used by a direct current method. The copper plating...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51601812692282678316 |