The Study of Substrate Warpage in QFN Package due to Shrinkage Rate of Molding Compound
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === This thesis is focused on the study of the warpage phenomenon in Quad Flat Non-Leads package (QFN). It is found that the formation of warpage (up or down) is due the stress force between molding compound and substrate, and it is an effective wa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13317158313791723944 |