Failure Analysis on Packaged IC with ESD/EOS Damage
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === This thesis aims the failure analysis due to electrostatic discharge(ESD) and electrical overstress (EOS) damage on IC packaging process. The ESD damage , including human body mode , machine mode , component charging mode and EOS damage were app...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/57489227769110353561 |