Interfacial Reactions between Lead-Free Solders and the Ni-xPd-yCo Alloys
碩士 === 國立臺灣科技大學 === 材料科學與工程系 === 103 === Ni is widely used as a diffusion barrier to avoid interfacial reaction between solders and the substrate in the packaging technology. In addition, there are studies regarding improving the reliability of lead-free solder joint by adding Co and Co-based alloys...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/29893877792314789557 |