Study on Laser Scribing for Low-k Wafer Dicing
碩士 === 國立臺灣科技大學 === 機械工程系 === 103 === The trend of semiconductor IC packaging demanding for higher I/O density with smaller and thinner chip scale or package form factor in order to keep up with Moore’s Law. The increase of transistor density introduces performance challenges such as electron charge...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37297689920620801831 |