Study on Space-confined Ni/Sn/Cu Diffusion Couples
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 103 === It is obvious that 3D IC integration is the mainstream in electronic packaging for the following decades. However, large volume fractions of IMC grains in 3D IC micro-joints would undoubtedly weaken the mechanical properties of the joints. Therefore, researc...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16463552026970631211 |