Probing Elastic Properties of Atomically-thin Interfacial Layer by Femtosecond Acoustics
碩士 === 國立臺灣大學 === 光電工程學研究所 === 103 === While the developing trend of modern electronic devices is toward scaling down, heat removal is a critical issue since thermal effect becomes seriously significant as dimensions shrink. Besides, many complex and denser structures such as 3D integrated circuits...
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| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/91772253942514860460 |