Study of an indirect capacitively coupled hydrogen/argon plasma discharge for atomic layer deposition process

碩士 === 國立清華大學 === 工程與系統科學系 === 103 === In the recent years, the semiconductor component size getting smaller and smaller. The metal oxide semiconductor field effect manufacturing process, after the size of less than 22 nm, the semiconductor process technology will face a big challenge. So Atomic Lay...

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Bibliographic Details
Main Authors: Chang, Teng Yen, 張登彥
Other Authors: Leou, Keh Chyang
Format: Others
Language:zh-TW
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/57333031999203764864