A Methodology for Alleviating Die Shift of Fan-Out Wafer-Level Packaging (FOWLP)
碩士 === 國立清華大學 === 資訊工程學系 === 103 === Fan-out Wafer Level Packaging (FOWLP), which performs the packaging of dies while still being part of the wafer, has attracted a lot of attention for advanced electronic products in recent years. However, in FOWLP, there is a mechanical problem, the die shift pro...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72905735841760367651 |