Ultrathin-ENEPIG Surface Finish in Low Impedance Soldering: Metallurgical Reactions, Bonding Strength, and Optimal Ni(P) Thickness Evaluation
博士 === 國立清華大學 === 材料科學工程學系 === 103 === The continuing thrust toward high-density and high-performance electronic devices has spurred development of more reliable solder joints in flip-chip technology. Successful solder joints not only give rise to metallurgically stable and mechanically robust b...
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| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99953397274183492670 |