Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 103 === Polymer material tends to absorb moisture of environment to cause volume swelling among various materials of electronic package, such as underfill and substrate. The residual moisture of the package would also be vaporized into vapor phase in the reflow pro...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36341092645919458639 |