On-Line Repair Architecture for TSV Arrays with Cluster Error Correction
碩士 === 國立彰化師範大學 === 電子工程學系 === 103 === Through-Silicon Vias (TSVs) may be used as interconnects for power supply, clock, synchronous or asynchronous connections in 3D-IC. But for circuit-level real-time systems, only several levels of logic gates are permitted for correcting and repairing within...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/41564117604460466770 |