Interleavers of Two-Dimensional Parity Check Codes for Fast Correcting Cluster Errors in TSV Arrays of 3D-ICs
碩士 === 國立彰化師範大學 === 電子工程學系 === 103 === Three dimensional integration of integrated circuits has been proved to be the major key infra-structure for extending and even exceeding the Moore's Law. However the yield of through-silicon vias (TSVs) of the 3D-ICs is still limited. According to the inc...
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| Format: | Others |
| Language: | zh-TW |
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2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54356066059626269600 |
| Summary: | 碩士 === 國立彰化師範大學 === 電子工程學系 === 103 === Three dimensional integration of integrated circuits has been proved to be the major key infra-structure for extending and even exceeding the Moore's Law. However the yield of through-silicon vias (TSVs) of the 3D-ICs is still limited. According to the increasing amount and dimension down-scaling the tradeoff will be made in the policy that the TSVs should be tested and repaired for decades. Furthermore the off-line repair can neither eliminate bit error rate completely nor ensure the normal operation on line.
To detect the aging symptoms people may execute an inductive fault analysis and construct a mapped fault model for detecting traditional faults. However not mention that some aliasing and over-kills will be spent in the defect-to-fault mapping, the test and detection may usually take a considerable operation range in allowance or slack. This will highly impact the performance. Therefore in this thesis, an error correcting methodology is adopted for detection and correction since the bit-error model is quite effect-cause deductive. We propose a novel linear mapping sliding algorithm for two-dimensional parity check(2DPC) codes to correct as more as possible cluster errors.
From the experimental results, our technique can obtain four times of correctable cluster size without extra cost compared with previous work. Also from the simulation the proposed technique can suffer the least time penalty so far. This makes the proposed technique the most potential methodology for real-time on-line TSV repairing technique.
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