Investigation of the Source and Distribution of Volatile Organic Compounds in Clean Rooms of a Wafer Level Packaging Factory
碩士 === 國立中央大學 === 環境工程研究所 === 103 === Similar to the front-end development of semiconductors, the (back-end) manufacturing process of Wafer Level Chip Scale Packaging (WLCSP) uses a tremendous amount of volatile organic compounds (VOCs), which may potentially cause a higher health risk to the employ...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/e4zf4a |