Study of Ultrasonic Bonding Technology of Discrete ABS to A5052 Aluminium Alloy for Electronic Device Cover Application
碩士 === 國立交通大學 === 機械工程系所 === 103 === By chasing for compact and slim electronic device, nowadays, metal housing has become the mainstream. However, higher transmission speed has to face a new issue - the metal electrical shielding. It means combining a plastic component at housing is necessary. Ther...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90955536132756712100 |