Fully Integrated BIST Circuit Designs for Delta-Sigma ADCs
博士 === 國立交通大學 === 電控工程研究所 === 103 === 3D ICs are considered as one of the emerging techniques for implementing the next-generation ICs. 3D IC techniques such as through-silicon via (TSV) provide vertical and shorter connections for inter-die communication. Thus, the 3D IC achieves many advantages...
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| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/07169981873351343988 |