NaDaP:TSV Noise-Aware &; Density-Aware Placement for 3-D ICs
碩士 === 國立交通大學 === 電信工程研究所 === 103 === In this work, we proposed a TSV noise-aware &; density-aware technique based on force-directed placement to reduce total noise and maximum peak noise of TSV in 3-D IC global placement stage. The peak noise value, which may lead to function errors in digital...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2015
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/k7qqck |