Improving the Lead-Free Solder-Paste Quality in Printing Process using Design of Experiments–A case Study of D Company
碩士 === 國立交通大學 === 管理學院工業工程與管理學程 === 103 === Due to the market demand of high speed computing, saving energy and size thinning in network production, the circuit design becomes complicated. This causes increasing density of devices. Accordingly, the size of SMD and the pitch of IC become smaller than...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/b6g6sf |