| Summary: | 碩士 === 明新科技大學 === 機械工程系精密機電工程碩士班 === 103 === Semiconductorpackaging processis very complicated. In the past, most of products are made by manual or semi-automation. Along with the rapid development ofthe communications, computerandmobile electronics,the demand of high power, small-chip-size semiconductor packaging equipment isincreasing. In the meantime, fully automatic packaging equipment is greatly needed under the requirement of high speed and high precision die bonding process.Hence, the purpose of this research is to cooperate with a local company to develop the desireddie-bonding equipment.
The research selects the ITO220 package process as the design objective. The parameters that may influence the process are investigated. The research found that the tin-dropping and tin-snapping procedures of the soldering process are the most important factors that may decide the quality. Hence, the research has built amachine that only consists of the transmission, heating, tin-dropping, and tin-snapping devices, which is used to get the optimal operational parameters.
Based on the information of the experiments, the research team discussed with the company, and decided to analyze and modify the previous soldering machine of the company. The goal is to tune the known parameters of the machine in order to improve its speed as well as the precision. To evaluate the performance of the machine, a high speed camera is used to observe the vibration of the mechanism, and a 2.5Dimage measurement equipment is used to detectthe die’s soldering offset. The histogram of the measurement is analyzed to show the precision of the bonding process. After many tests and analysis, the results show that the cycle time and the precision of the machine is greatly improved.
Keywords：Pick and Place, Die Bonder
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