Research and application of the high powersemiconductor packaging equipment
碩士 === 明新科技大學 === 機械工程系精密機電工程碩士班 === 103 === Semiconductorpackaging processis very complicated. In the past, most of products are made by manual or semi-automation. Along with the rapid development ofthe communications, computerandmobile electronics,the demand of high power, small-chip-size semi...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13435820056954416897 |