A Study on the Warpage of the Top Cover with Thin Wall Injection Molding for the Digital Memory Box
碩士 === 明新科技大學 === 機械工程系精密機電工程碩士班 === 103 === To reduce the material cost for the injected molding plastic parts, thin wall design becomes a main direction. But the process to obtain the thin-wall is encountered some thickness/distortion and warpage problems. How to improve and avoid this deformation...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36681981474139884028 |