Improving the Lead Bonding Accuracy of Chip on Film by the Taguchi Method
碩士 === 國立高雄應用科技大學 === 工業工程與管理系碩士在職專班 === 103 === The purpose of this study is to explore the effects of coplanarity during the Inner Lead Bonding (ILB) Process of Chip on Film (COF) assembly using the Taguchi method. This study finds that different bonding times and forces cause variations in the st...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/c25avg |