Analyze for Crown Needle Pogo Vertical Probe Card under Wafer Testing
碩士 === 國立高雄應用科技大學 === 模具工程系 === 103 === Probe card contact with bumps of wafer to measure electrical properties is good or not and probe cause permanent indentations on the bumps. Crown needle pogo vertical probe card is the latest developments in the past few years. The crown needle pogo has co...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/15556651305574369750 |