Mechanicals Behavior of Copper Pillar Bump
碩士 === 國立高雄應用科技大學 === 模具工程系碩士班 === 102 === In this paper, according the wafer probing experimental to establish the finite elements analysis model. We used the Paliney7 (P7) probe to analyze the change of probe mark area ratio. And, three different Cu pillars bumps (63Sn-37Pb) , which are on the pil...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03899840982568253561 |