A Silicon-based LED Packaging Substrate with Deep Trench for Encapsulation Shaping

• Main Author: 朱禹光
• Other Authors: 鄒慶福
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/21204923719887314793

碩士 === 逢甲大學 === 自動控制工程學系 === 103 === This study proposes an encapsulation shaping method for white light LED packaging based on a silicon substrate with deep trench and by using a simple YAG phosphor dispensing process. The technology utilizes the interaction of the interfacial tension between silicon island structure and silicone phosphor material for encapsulation shaping at an appropriate curing temperature. By Surface Evolver, we successfully predict the profile of silicone phosphor material. Various encapsulation structures, such as hemispherical-like, hemispherical and shell-type lenses, have fabricated through different encapsulation doses, which can be used to meet the specific optical requirements. Experiment results show that the hemispherical-like encapsulation lens can be fabricated when the dispensing does is 1.0 mm3. The hemispherical encapsulation lens in a curvature radius of 0.9 mm was formed, when the diameter of island structure is designed as 1.8 mm and the dispensing dose is 1.5 mm3. When the dispensing doses are 2.5 mm3 and 4.0 mm3, shell-type lens structures with short and long columns were fabricated, respectively. In terms of optical characteristics with shell-type structure, the measured chromaticity variation at different view angles is large, but the case with short encapsulation cylinder can effectively improve the lighting uniformity. The simulation result of luminance profile is in agreement with the experiment.