A Silicon-based LED Packaging Substrate with Deep Trench for Encapsulation Shaping
碩士 === 逢甲大學 === 自動控制工程學系 === 103 === This study proposes an encapsulation shaping method for white light LED packaging based on a silicon substrate with deep trench and by using a simple YAG phosphor dispensing process. The technology utilizes the interaction of the interfacial tension between silic...
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| Format: | Others |
| Language: | zh-TW |
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2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/21204923719887314793 |