Mechanical Behavior Investigation of Creep and Warpage for Thin-Type three-Dimensional Integrated Circuits Packaging Structures
碩士 === 中原大學 === 機械工程研究所 === 103 === In recent years, the mainstreams of electronic products are gradually moving to small size, lightweight and multi-functions. To satisfy abovementioned requirements, putting the most of chips in a limited space is a possible way. However, the semiconductor mini...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4h9c9f |