The Effect of Argon Plasma Activation on the Die-Shear Force and Reliability of Chips and Flex Substrates Assembly Using a Non-conductive Film
碩士 === 中山醫學大學 === 職業安全衛生學系碩士班 === 103 === A non-conductive film (NCF) and the thermal compression bonding process were combined to assemble chips and flex substrates. Two purposes of this study are expected to achieve chips bonded on flex substrates directly and to verify the reliability of chips an...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/92477356133412461509 |