The Effect of Organic Additives on The Ability of Filling The Blind Micro-via in PCB

• Main Authors: Shao-Tang Ding, 丁紹堂
• Other Authors: Yu-Li Lin
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/29049668160271780146

碩士 === 中華大學 === 機械工程學系碩士班 === 103 === The purpose of this study is to find out the effect of various organic additives at specific concentration on filling the blind micro-via in PCB. The size of blind micro-via used in this study is 4 mil. In experiment, we used the high copper low acid solution as a base of chemical solution, In filling the blind micro-via of electroplating processes, the current density of 20 ASF and the plating duration of 60 minutes were used. The filling performance was judged according to the industry demand. In this study, several combinations were utilized by using various molecular weight of suppressors, note as A3+A4, A2+A4 and A1+A4. The leveler used in this study was noted as L and the brightener used in this study was noted as B. In A1+A4 system, the best filling performance was found when the chemical composition was composed of 7.5 (mL/L) A1, 7.5 (mL/L) A4, 3 (mL/L) L1, 0.85 (mL/L) L2 and 2.5 (mL/L) B1. The results show that ST (Surface Thickness) can be measured to be 14μm, the dimple can be measured to be 7.6μm. The filling performance was about 90.1%. In A2+A4 system, the best filling performance was found when the chemical composition was composed of 8.5 (mL/L) A2, 8.5 (mL/L) A4, 3.5 (mL/L) L1, 1 (mL/L) L2 and 4.5 (mL/L) B1. The results show that ST can be measured to be 8.45μm, the dimple can be measured to be 9.9μm. The filling performance was about 89.1%. In A3+A4 system, the best filling performance was found when the chemical composition was composed of 8.5 (mL/L) A3, 8.5 (mL/L) A4, and 3 (mL/L) B1. The dimple also can be measured to be 11.5μm when the chemical composition was composed of 5.5 (mL/L) L1 or 10.5 (mL/L) L1. The results show that ST can be measured to be 18.8μm, the filling performance was about 90.1% when L1 was 5.5 (mL/L). The results show that ST can be measured to be 14.7μm, the filling performance was about 87.1% when L1 was 10.5 (mL/L). In the consumption of additive in system A1+A4, it was found that the consumption rate of L1+L2 was measured to be 81.6%. The consumption rate of B1 was measured to be 58%. While, the consumption rate of suppressor A1+A4 was measured to be 28 %. All the results were measured in one hour of electroplating processes.