The Effect of Organic Additives on The Ability of Filling The Blind Micro-via in PCB
碩士 === 中華大學 === 機械工程學系碩士班 === 103 === The purpose of this study is to find out the effect of various organic additives at specific concentration on filling the blind micro-via in PCB. The size of blind micro-via used in this study is 4 mil. In experiment, we used the high copper low acid solution as...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/29049668160271780146 |