Effect of TSV-Induced Stresses on Carrier Mobility and Strength of 3-D IC Chips
博士 === 長庚大學 === 機械工程學系 === 103 === The 3-D integration of integrated circuit (IC) chips is to bring significant benefits to IC packaging by providing better electrical performance, lower power consumption, and smaller form factor. Currently the technology of through-silicon via (TSV) is one of most...
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| Format: | Others |
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2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/64049970167383966013 |