FMEA Integrate Quality Control System To Study How To Improve Rework Rates Of Photo Resist.

• Main Authors: Hui-Ting Chang, 張惠婷
• Other Authors: Yun-Shiow Chen
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/53167938416679400814

碩士 === 元智大學 === 工業工程與管理學系 === 102 === For the manufacturing process of wafer level package, photo resist is one of the main materials that might cause environment pollution. Usually we lead photo resist to start the chemical reaction and get the wafer layout we need. But also some poisonous waste will be produced at the same time. These waste must be took a lot of cost for subcontractors to set the related equipment, deal with the pollution problems and fit with environmental laws. In consideration of the topic of environmental protection is more and more important , this paper is focused on how to decrease the rework of photo resist during the manufacturing process of wafer level package because the major waste was came from the process output of photo resist. In order to analyze the failure deeply and make the improvement plan, FMEA is used to integrated quality system and built up the research framework in this paper. And the feedback procedure is also defined in the following chapter to display how to expand the improvement action into FMEA and quality system. In the case study, the important three abnormalities are found through the past data analysis. The data is showed that the rework issues are caused mainly by photo resist bubble, alignment shift and deformed pattern. After reviewed the control carelessness upon the recent content of FMEA and quality system, the improvement action is decided. The frequency of sputter equipment maintenance is adjusted by linear regression analysis. The wafer placement test is added to improve alignment shift and the queue time between exposure and develop processes is modified. Per these improvement action, the rework rate of photo resist is reduced effectively from 2.04% to 0.71%.