The Study of Increasing Solder Ball Adhesive Attraction in Ball placement Process
碩士 === 國立雲林科技大學 === 工業工程與管理系 === 102 === This study is using the Cause-and-Effect diagram (fish bone) to analyze and find the key factors for the produce case of semiconductor assembly packaging BGA(Ball Grid Array)product, add plasma cleaning before the ball placement process as experience target...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54007893428495078602 |