A comparative study on the purge methods for 450 mm wafer FOUPs
碩士 === 國立臺北科技大學 === 能源與冷凍空調工程系碩士班 === 102 === For 450mm wafer FOUPs, purge nitrogen or clean dry air (CDA) becomes a must during the wafers in transportation or storage. However, the performance of continuous purging of nitrogen or CDA must be improved in terms of efficiency, cost and gas volume. In...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/vvs8x9 |
| Summary: | 碩士 === 國立臺北科技大學 === 能源與冷凍空調工程系碩士班 === 102 === For 450mm wafer FOUPs, purge nitrogen or clean dry air (CDA) becomes a must during the wafers in transportation or storage. However, the performance of continuous purging of nitrogen or CDA must be improved in terms of efficiency, cost and gas volume. In this study, the time-depletion of moisture and oxygen during purging process by three different purge methods including traditional 2 inlets/2 outlets (method 1) , purge with diffusers (method 2), and combine vacuumed and purge (method 3) are compared and discussed. Significant improvement of purge performance is presented.
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