A comparative study on the purge methods for 450 mm wafer FOUPs

碩士 === 國立臺北科技大學 === 能源與冷凍空調工程系碩士班 === 102 === For 450mm wafer FOUPs, purge nitrogen or clean dry air (CDA) becomes a must during the wafers in transportation or storage. However, the performance of continuous purging of nitrogen or CDA must be improved in terms of efficiency, cost and gas volume. In...

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Bibliographic Details
Main Authors: ZHE-YU HUANG, 黃哲宇
Other Authors: Shih-Cheng Hu
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/vvs8x9