Fabrication of A Novel Intelligent Probe Card

• Main Authors: Tien-Yen Chiang, 江典諺
• Other Authors: Jung-Tang Huang
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/gg7sh2

碩士 === 國立臺北科技大學 === 機電整合研究所 === 102 === The development of high-frequency components has been continually pushing area-reduction in the semiconductor manufacturing process. The wafer probe card is a kind of tool for rapid detection and assurance of yield rate. However, how to make an effective low-cost probe card for testing small high-frequency components is a challenge for a lot of probe card companies. Considering the high frequency parasitic effects and reflection phenomena, each probe should be manufactured with precise shape and geometry. Thus, this paper presents a MEMS process for fabricating the probe. In order to improve the RF structure features, glass substrates are used instead of silicon ones. Through Glass Via (TGV) technology is combined with Re-distribution Layer (RDL) for providing the layout on the back of the glass substrate, which can facilitate the placement of the other circuit components. The probe fabricated by MEMS technology has some problems such as low probe contact force, a complex production process and large transmission loss when operated at high frequency, and the tip of the probe contact with wafer will generate debris during measuring. In this research, the simulation software Ansoft HFSS and Ansys Workbench are used to simulate and design the probe S-parameter S11<-40dB, S21 > -0.02dB, structure stress and shear force. After the simulation, the probe cavity and electro-forming nickel-manganese alloy are manufactured. The purpose is to increase the thickness of the probe cantilever to enhance its strength and improve the skin effect by coating the gold around the probe. This research is mainly focused to solve the manufacturing problems of the probe card.