The Study on the Designs and Process of Integrated Cold-plate of Al-alloy
碩士 === 國立臺北科技大學 === 製造科技研究所 === 102 === This study of transient liquid phase of diffusion bonding of 6061 alloy with pure Zinc filler is successfully bonded. The bonding temperature of the process was adjusted at 420℃, 450℃ and 480℃ for 1 hour and 2 hours separately. Meanwhile, we did T6 heat trea...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/rapgga |