Applying Monte Carlo Simulation to Analyze the Open Scenario in the Assembly of Electronic Components
碩士 === 國立臺北科技大學 === 工業工程與管理系碩士班 === 102 === As the environmental awareness continues to rise, the issue of green package is serious importance. While the traditional solder reflow process is replaced by the lead free process, the reflow temperature will raise to 260℃. Because the component and boa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/sr7w2d |