Exploring The Impacts of Introducing Three Dimensional Stacking Technology on Taiwan Semiconductor Value Chain
碩士 === 南台科技大學 === 科技管理研究所 === 102 === While the end consumer electronics continue to evolve in the tail era, the direction of R&D is to pursuit more diversified functions, miniaturization, and even lighter weights. Through Silicon Via (TSV) technology applied in Three Dimensional Integrated Circ...
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| Format: | Others |
| Language: | zh-TW |
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| Online Access: | http://ndltd.ncl.edu.tw/handle/95354532700747967951 |