Numerical Studies of Lead-free solder Subjected to Drop Stress and Thermal Cycling Tests
碩士 === 國立虎尾科技大學 === 機械與機電工程研究所 === 102 === Abstract in-lead alloy (63Sn37Pb) is a solder ball material and electronic components for surface treatment, one of the most widely used metal materials, due to the industry''s long-term use, the nature of the tin-lead solder has a conside...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7q82h6 |