A Study on Mechanical Flexibility of Silicon Oxynitride and Organic/inorganic Multilayered Barrier Structures Deposited on Flexible Plastic Substrates

• Main Authors: Ji-Ting Huang, 黃吉廷
• Other Authors: Day-shan Liu
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/59du8h

碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 102 === In this study, tetramethyl silane (tetramethysilane; TMS), ammonia gas is mixed with oxygen and other sources of gas, electricity pulp interest enhanced chemical vapor deposition system (Plasma-enhanced chemical vapor deposition; PECVD), in the flexible plastic substrate organic / inorganic oxynitride on multi-gas at low temperatures preparation has excellent gas barrier film barrier capability and adding organic silicon thin film as a buffer layer prepared multilayer organic silicon / silicon oxynitride inorganic thin film structure, by modulating the grassroots organic silicon film thickness, control the overall structure of the internal stress, improve water vapor barrier ability, research shows that you can make a film thickness of a single layer of residual stress silicon oxynitride film 300 nm of the (-372 Mpa) when the addition of a suitable organic silicon film thickness as a buffer layer to decrease the residual stress film -303 Mpa, and in the adhesion of the plastic film may be lifted from the substrate 3B to 5B grade level, while in the optimization of three pairs of organic / inorganic oxynitride film structure by calcium test method (Calcium test) measure its water vapor permeability, water vapor was observed at room temperature penetration rate of approximately 5.5 × 10-4 g/m2/day. After the addition, the use of homemade bend test equipment, optimized multilayer structure observed in the surface morphology deflection shape under different circumstances and their impact on water vapor permeability, the study showed that the addition of organic silicon thin film as a buffer layer , one, two, and three pairs of the multilayer structure, than can the relative thickness 300 nm, 600 nm and 900 nm curvature critical breakage, showing the structure of a multilayer film having deposited on the flexible plastic substrate is preferably a flexural reliability. Finally, the study of its silicon multilayer organic / inorganic oxynitride structures used in organic light-emitting diodes (Organic light emitting diode; OLED) of the packaging process, the preparation at 300nm on a single layer of silicon oxynitride flexible plastic substrate as cover, compared to unpackaged die organic light-emitting diodes, which can improve the operating life from 53 hours to 314 hours, which can improve the life of about six times, in addition to directly to the 300nm single layer SiON Preparation as a thin film encapsulation on organic light-emitting diode device, which can improve the operating life from 53 hours to 159 hours, about three times the life upgrade.