Optimization of The De-Flash Process for EMC Leadframe
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 102 === EMC(Epoxy Molding Compound) is a highly integrated frame type used in molding packaging process which adopts new epoxy material and substrate etching techniques. In the process of formation, since the glue would leak out during the high temperature and pres...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/36k38v |