Effect of Silicon Carbide Thin Film on Al-Based AuSn Eutectic Bonding Joint
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 102 === In this study, the motivation is for the reference of DLC structure, silicon carbide deposited before aluminum film to discussing its effect of the Al-Base AuSn eutectic bonding joint structure. Because Al surface can’t electroplate direct, so first used Zn...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/f9mq8p |